Title page for ETD etd-03042009-040331
|Type of Document
||Design and fabrication of an underwater digital signal processor multichip module on low temperature cofired ceramic
||Master of Science
|Elshabini-Riad, Aicha A.
|Moore, Daniel J.
|Riad, Sedki Mohamed
- Multichip modules (Microelectronics)
|Date of Defense
An Underwater Digital Signal Processor (UDSP) multichip module (MCM) was
designed and fabricated according to specifications outlined by the Naval Surface Warfare
Center (NSWC), Dahlgren Division. Specifications indicated that low temperature cofired
ceramic (L TCC) technology be used to fabricate the MCM with surface dimensions of
2"x2". The top surface of the module was to be designed to enclose mounted components
and bare dice, and the bottom surface was to be equipped with a 144 pin grid array
(PGA). The LTCC technology selected for this application incorporated DuPont's 951
Green Tape™ and compatible materials and pastes. A mixed metal system using inner
silver system and outer surface gold system was used. Harris Corporation's FINESSE
MCMTM, a computer-aided design (CAD) tool, was used to design the surface
components and produce the circuit layout. FREESTYLE MCM™, an autorouter, was
used to accomplish the routing of the signal layers. The design information provided by
FINESSE MCM™ and FREESTYLE MCM™ was utilized to produce the artwork
necessary for fabrication. Fabrication of the module was accomplished in part using thick
film processes to produce the conducting areas on each layer. The layers were stacked in
a press, laminated, and fired. Conducting areas were screen printed on the top surface of
the module for wire bonding and on the bottom surface of the module for pin attachment.
The main objectives of this thesis work were to convert silicon UDSP MCM to
ceramic using LTCC, learn a new tool in CAD design that incorporates an autorouter,
apply the tool to design a MCM-C module, and to develop criteria to evaluate the MCM.
Future research work includes conducting line continuity testing, materials evaluation to
determine reactions at interfaces and via filling, and resistance and electrical crosstalk
measurements on the module.
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