Type of Document	Master's Thesis
Author	Creel, Kenneth E
URN	etd-05042010-020340
Title	A thermal analysis tool for three-dimensional models of multilayer microelectronics
Degree	Master of Science
Department	Mechanical Engineering
Advisory Committee	Advisor Name Title Nelson, Douglas J. Committee Chair Elshabini-Riad, Aicha A. Committee Member Vick, Brian L. Committee Member
Keywords	Microelectronic packaging
Date of Defense	1994-07-05
Availability	restricted
Abstract see document
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