Title page for ETD etd-05142014-131824


Type of Document Master's Thesis
Author DiMarino, Christina Marie
Author's Email Address dimaricm@vt.edu
URN etd-05142014-131824
Title High Temperature Characterization and Analysis of Silicon Carbide (SiC) Power Semiconductor Transistors
Degree Master of Science
Department Electrical and Computer Engineering
Advisory Committee
Advisor Name Title
Dushan Boroyevich Committee Co-Chair
Rolando Burgos Committee Co-Chair
Louis Guido Committee Member
Keywords
  • power semiconductor devices
  • SiC MOSFET
  • SiC BJT
  • SiC JFET
  • high temperature
  • characterization
  • silicon carbide
Date of Defense 2014-05-02
Availability unrestricted
Abstract
This thesis provides insight into state-of-the-art 1.2 kV silicon carbide (SiC) power semiconductor transistors, including the MOSFET, BJT, SJT, and normally-on and normally-off JFETs. Both commercial and sample devices from the semiconductor industry’s well-known manufacturers were evaluated in this study. These manufacturers include: Cree Inc., ROHM Semiconductor, General Electric, Fairchild Semiconductor, GeneSiC Semiconductor, Infineon Technologies, and SemiSouth Laboratories. To carry out this work, static characterization of each device was performed from 25 ºC to 200 ºC. Dynamic characterization was also conducted through double-pulse tests. Accordingly, this thesis describes the experimental setup used and the different measurements conducted, which comprise: threshold voltage, transconductance, current gain, specific on-resistance, parasitic capacitances, internal gate resistance, and the turn on and turn off switching times and energies. For the latter, the driving method used for each device is described in detail. Furthermore, for the devices that require on-state dc currents, driving losses are taken into consideration. While all of the SiC transistors characterized in this thesis demonstrated low specific on-resistances, the SiC BJT showed the lowest, with Fairchild’s FSICBH057A120 SiC BJT having 3.6 mΩ•cm2 (using die area) at 25 ºC. However, the on-resistance of GE’s SiC MOSFET proved to have the smallest temperature dependency, increasing by only 59 % from 25 ºC to 200 ºC. From the dynamic characterization, it was shown that Cree’s C2M0080120D second generation SiC MOSFET achieved dv/dt rates of 57 V/ns. The SiC MOSFETs also featured low turn off switching energy losses, which were typically less than 70 µJ at 600 V bus voltage and 20 A load current.
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