Title page for ETD etd-08282003-155344
|Type of Document
||Ezzell, Stephen A.
||Modification of polyimide films via tin complex incorporation
||Master of Science
|Taylor, Larry T.
|Harris, Paul J.
|McGrath, James E.
|Date of Defense
The modification of polyimide films by tin-complex incorporation
has been studied with the aim of producing materials with the mechanical
and thermal properties of polyimide with enhanced electrical properties.
A variety of Sn(II) and Sn(IV) complexes have been incorporated into
BTDA/ODA (3,3 14,4 1-benzophenonetetracarboxylic acid dianhydride / 4,41-
oxydianiline) and PMDA/ODA (pyromellitic dianhydride/4,4 1 -oxydianiline)
derived polyimides in a 1:4 (complex/polymer repeat unit) molar ratio.
Tin-complex incorporation was seen to have a variety of effects
upon polyimide properties, depending upon the particular tin-complex
employed. All films produced were thermally stable with decomposition
temperatures> 500°C. Most films were homogeneous and flexible.
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