| Type of Document |
Master's Thesis |
| Author |
Reichl, John Vincent
|
| Author's Email Address |
john.reichl@ngc.com |
| URN |
etd-12132005-120603 |
| Title |
Inverter Dynamic Electro-Thermal Simulation with Experimental Verification |
| Degree |
Master of Science |
| Department |
Electrical and Computer Engineering |
| Advisory Committee |
| Advisor Name |
Title |
| Lai, Jason |
Committee Chair |
| Hefner, Allen |
Committee Co-Chair |
| Lu, Guo-Quan |
Committee Member |
|
| Keywords |
- inverter
- electro-thermal simulation
|
| Date of Defense |
2005-11-29 |
| Availability |
unrestricted |
Abstract
A full electro-thermal simulation of a three-phase space-vector-modulated (SVM) inverter is performed and validated with measurements. Electrical parameters are extracted over temperature for the insulated gate bipolar transistor (IGBT) and diode electro-thermal models. A thermal network methodology that includes thermal coupling between devices is applied to a six-pack module package containing multiple IGBT and diode chips. The electro-thermal device models and six-pack module thermal model are used to simulate SVM inverter operation at several power levels. Good agreement between model and measurement is obtained for steady state operation of the three-phase inverter. In addition, transient heating of a single IGBT in the six-pack module is modeled and validated, yielding good agreement.
|
| Files |
| Filename |
Size |
Approximate Download Time
(Hours:Minutes:Seconds)
|
| 28.8 Modem |
56K Modem |
ISDN (64 Kb) |
ISDN (128 Kb) |
Higher-speed Access |
| |
reichl_thesis_final2.PDF |
2.51 Mb |
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