Type of Document	Master's Thesis
Author	Siddabattula, Kalyan C.
URN	etd-121399-153938
Title	Electromagnetic Modeling of Packaging Layout in Power Electronic Modules
Degree	Master of Science
Department	Electrical and Computer Engineering
Advisory Committee	Advisor Name Title Boroyevich, Dushan Committee Chair Lee, Fred C. Committee Member Lu, Guo-Quan Committee Member
Keywords	Packaging Modeling
Date of Defense	1999-12-03
Availability	unrestricted
Abstract This thesis presents the modeling approaches and the challenges involved in electromagnetic modeling of packaging layout. It discusses the methodologies that are being used today. It then applies these methodologies to analyze, model and characterize three packaging technologies: (i) the wirebond technology, (ii) The Metal Post Interconnected Parallel Plate Structure, and the (iii) Multi Layer Structure. The model developed is validated through experimentation. These models are then used in simulation in order to compare the electrical performance of the packaging technologies. Finally some problems with the existing designs are pointed out, and suggestions (both local and generic) are given to improve the layout design.
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