Type of Document Master's Thesis Author Siddabattula, Kalyan C. URN etd-121399-153938 Title Electromagnetic Modeling of Packaging Layout in Power Electronic Modules Degree Master of Science Department Electrical and Computer Engineering Advisory Committee
Advisor Name Title Boroyevich, Dushan Committee Chair Lee, Fred C. Committee Member Lu, Guo-Quan Committee Member Keywords
Date of Defense 1999-12-03 Availability unrestricted AbstractThis thesis presents the modeling approaches and
the challenges involved in electromagnetic
modeling of packaging layout. It discusses the
methodologies that are being used today. It then
applies these methodologies to analyze, model
and characterize three packaging technologies:
(i) the wirebond technology,
(ii) The Metal Post Interconnected Parallel Plate
Structure, and the
(iii) Multi Layer Structure.
The model developed is validated through
experimentation. These models are then used in
simulation in order to compare the electrical
performance of the packaging technologies.
Finally some problems with the existing designs
are pointed out, and suggestions (both local and
generic) are given to improve the layout design.
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